FIELD: electronic engineering. SUBSTANCE: introduced in conducting compound including powdered gold or silver and low-melting glass powder is ruthenium oxide powder, proportion of ingredients being as follows, mass percent: gold and silver powder - 78-95; ruthenium dioxide powder - 2.5-8; low-melting glass powder - 2.5-14. EFFECT: improved quality of panel electrodes. 3 ex
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Authors
Dates
2000-01-10—Published
1998-07-28—Filed