FIELD: radio engineering, in particular, manufacturing of printed circuit boards. SUBSTANCE: method involves production of composite structure of substrate and foil, making a surface contact between upper front surface of structure in center with front surface of composite structure of impregnated tape to produce stack, which is subjected to heating and pressurizing in order to bind upper front surface of foil to front surface of impregnated tape. Then stack is disassembled, so that composite member with composite structure of impregnated tape and foil and removed member of substrate are produced. In addition upon manufacturing of composite layer of substrate and foil, method involves gluing substrate and foil with flexible glue in glue band which embraces perimeter of given central region of composite structure of substrate and foil. EFFECT: facilitated manipulations with thin copper foil, keeping foil out of impurities and prevention of resin leaks. 6 cl, 5 dwg
