FIELD: manufacture of reinforced laminates for printed circuit boards. SUBSTANCE: prepreg for printed circuit board base comprises polymeric material and cloth containing glass fibers and coating compatible with matrix material. Prepreg has drill wear factor not in the excess of 32%, which is determined after drilling of 2,000 holes through pile of tree laminates. Each laminate includes eight prepregs at hole density of 62 holes per square cm and feeding of 0.001 per one revolution, when drill used is made of tungsten carbide and has diameter of 0.46 mm. EFFECT: reduced wear of drill tip, increased precision in arrangement of drilled holes, and increased efficiency of spinning equipment. 56 cl, 8 dwg, 7 tbl, 2 ex
