METHOD OF MOUNTING LED LAMPS Russian patent published in 2019 - IPC F21V21/05 H05K1/11 F21V29/10 H05K3/20 

FIELD: lighting engineering.

SUBSTANCE: method of mounting LED boards can be used in high-power LED lamps. High-power LED lamps increase temperature of LED crystals, which reduces service life of lamps. To reduce the temperature of LED crystals, heat removal from LED is currently carried out using special printed-circuit boards with insulated metal substrate. Copper foil of the printed-circuit board has increased thickness and is separated from the metal substrate by a thin layer of heat conducting electric insulation. Disadvantages of using such material for printed-circuit boards are: high copper consumption associated with copper etching from board free areas; longer time for making printed circuit boards, which is proportional to thickness of copper layer (rate of etching copper when using nozzles of about 35 mcm/min); limitation of maximum thickness of copper layer due to technological reasons; deterioration of electrodes manufacturing accuracy with increase of copper layer thickness. Technical result is achieved by the proposed mounting method, in which double-sided adhesive film is glued onto the aluminum substrate. On this film by automatic device for installation of electronic elements are installed according to special program copper flat electrodes cut from copper strip of selected thickness, each electrode is pressed with the force required for gluing to the adhesive film, after which the automatic device for assembling electronic elements sets the LEDs onto the copper electrodes through the flux, after installation of all elements, soldering is performed in a programmable furnace.

EFFECT: longer service life of the lamps by reducing thermal resistance of the LED – metal substrate of the printed-circuit board, low copper consumption, low labor input.

1 cl, 2 dwg, 1 tbl