FIELD: manufacture of soldered joints, namely connection of integrated circuits to printed circuit boards. SUBSTANCE: method comprises steps of passing drops of melt solder through adaptor with opening; introducing flux to opening of adaptor; providing flux permeation into opening of adaptor and onto passing melt solder; heating adaptor in order to provide flux permeation. Flux may be introduced by injection from opening of adaptor through pipe or by moving adaptor until its contact with flux source. EFFECT: possibility for receiving melt solder drops with optimal stable size and shape. 10 cl, 8 dwg
