PACKAGE TO MOUNT CHIP IN INTEGRATED CIRCUIT AND PROCESS OF ITS ASSEMBLY Russian patent published in 2002 - IPC

FIELD: electronics. SUBSTANCE: invention is related to mounting of chips of integrated circuits into package. Package includes chip holder carrying metal substrate that incorporates first and second opposite face surfaces. At least one face surface has dielectric coat on which electric circuits including assembly lands of crystal, termination pads and circuit tracks connecting assembly lands and termination pads are arranged. Chip of integrated circuit is mounted on face surface of metal substrate carrying dielectric coat by method of turned crystal or method of hookup of wire leads or method of cementing. In any case chip of integrated circuit is electrically connected to assembly lands of chip either with drops of solder or with use of wire connections. Electric leads protrude from termination pads on chip holder and are connected to proper pads on circuit package or on something like it to generate input/output signals for chip of integrated circuit. EFFECT: improved properties of heat transfer and good electric properties of chip holder, floating plane of grounding included. 12 cl, 6 dwg