ORGANIC CHIP HOLDER FOR INTEGRATED CIRCUITS WITH WIRE CONNECTIONS Russian patent published in 2000 - IPC

FIELD: microelectronics; integrated circuit manufacture. SUBSTANCE: organic insulating materials are used in chip holder manufacture instead of conventional ceramics. Such chip holder has at least one organic insulating layer whereon pattern can be formed by photolithography. This layer has metallized holes for interconnecting two or more output branching circuits. In addition, chip holder has single-tier space to receive chip. Chip holder incorporates heat-transfer holes and/or metal layer made directly under chip to improve heat dissipation. Chip holder dispenses with mechanically drilled holes for interconnecting various layers of circuit. EFFECT: improved signal propagation speed and heat dissipation, reduced transit time. 6 cl, 6 dwg