FIELD: electroplating, particularly, application of copper coatings; in various branches of industry. SUBSTANCE: electrolyte contains, g/l: pentaaquo-copper sulfate, 5-100; copper diglycinate -Ci(Gly)2, 40-150; aminoacetic acid Gly, 0.25-1; sodium sulfate, 30-130; organic additive, 0.5-5. In addition, organic additive in electrolyte may be used in the form of mono- or polysaccharides. EFFECT: higher cohesion of coating with metal and increased coating strength due to deposition of copper from nontoxic complex aminoacetate compound in presence of background electrolyte (sodium sulfate) and buffer system based on aminoacetic acid. 4 cl, 2 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| ELECTROLYTE FOR DEPOSITION OF NICKEL COATING | 2000 |
|
RU2176688C1 |
| COPPER ELECTROPLATING METHOD | 2022 |
|
RU2779419C1 |
| METHOD OF PLATING BY TIN | 2007 |
|
RU2341592C1 |
| OXALATE ELECTROLYTE FOR COPPER-TIN ALLOY DEPOSITION | 2015 |
|
RU2613838C1 |
| ELECTROLYTE AND METHOD OF COPPER SEDIMENTATION ON THIN CONDUCTIVE SUBLAYER ON SURFACE OF SILICIC PLATES | 2012 |
|
RU2510631C1 |
| ELECTROLYTE FOR PRECIPITATION OF COATING MADE OF ALLOY COPPER-TIN | 1992 |
|
RU2029799C1 |
| TECHNIQUE OF CHEMICAL PLATING MADE FROM ALLOY NICKEL-COPPER-PHOSPHORUS | 2007 |
|
RU2343222C1 |
| ELECTROLYTE FOR ELECTROCHEMICAL DEPOSITION OF COATINGS NICKEL-BORON | 2008 |
|
RU2357015C1 |
| STEEL ARTICLES COPPER PLATING SOLUTION | 2019 |
|
RU2716910C1 |
| ELECTROLYTE FOR COPPER PLATING | 0 |
|
SU1650786A1 |
