MICROSTRIP LOAD Russian patent published in 2002 - IPC

FIELD: SHF equipment. SUBSTANCE: microstrip load has dielectric substrate which side carries grounding base and which other side has film resistor connected with one end to shorting device and with the other end to sections of microstrip lines connecting film resistor to input microstrip line connected in series. Sections of microstrip lines are fabricated from resistive material gradually enlarging in width from input microstrip line to film resistor. Conductors rounded over outer edges are deposited in points of interconnection of microstrip lines, in points of connection to input microstrip line and to film resistor. Inner edges of conductors have protrusions. Width of resistive material can change in quarter length of wave, rounding can have form of parts of circumference and protrusions of adjacent conductors can touch one another. EFFECT: increased permissible dissipated power, enlarged width of working frequency band. 2 cl, 2 dwg