MICROSTRIP LOAD Russian patent published in 2007 - IPC H01P1/26 

FIELD: radio engineering; microwave engineering; radars, radio communications, and measurement technology.

SUBSTANCE: proposed microstrip load has board in the form of insulating plate carrying electricity-conductive screen, electricity-conductive input microstrip line, and shorting device. Resistive absorbing layer with electricity-conductive components connected in parallel with the latter is electrically connected between input microstrip line and shorting device. Load also has additional electricity-conductive screen, N additional insulating plates being disposed in a spaced relation to each other above board in the form of plate, where N is natural series of numbers; coefficient of heat conductivity of these additional plates is higher than that of board material. N - 1 additional resistive absorbing layers with additional electricity-conductive components connected in parallel with them are also placed between N additional plates. Components disposed in clearances are interrupted structures abutting against lateral edges of absorbing layers; they are made of electricity-conductive material whose melting point is lower than that of resistive electricity-conductive material of microstrip line and shorting device. Additional electricity-conductive screen is applied to upper surface of N^th additional insulating plate and its thickness and heat capacity are greater than those of N^th additional insulating plate. Electricity-conductive screen and board can be provided with hole under absorbing layer to receive adjusting insert made of electricity-conductive material whose phase transform starts at temperature below melting point of resistive material and electricity-conductive material of microstrip line and shorting device. Plate-to-plate clearances may reduce in direction from input microstrip line to shorting device. Clearances between all plates and thickness of all plates may reduce in direction from board to N^th plate and width may increase in direction from board to N^th plate. Components can be made in the form of interrupted structures abutting against lateral edges of stub absorbing layers; intervals of interrupted components may increase in direction from input microstrip line to shorting device. Absorbing layers may have different width and their edges may be disposed one on top of other.

EFFECT: enhanced pulsed-mode dissipation power, facilitated adjustment and its safety, ability of adjusting device matching.

6 cl, 4 dwg