FIELD: equipment for mounting heat sink in electronic module package. SUBSTANCE: assembly has at least two flexible holding posts spaced apart with their ends being frictionally engageable with heat sink so that the latter is secured relative to electronic device. Flexible holding posts are attached to substrate dispensing with holes and stretch along heat radiating device to heat sink port wherein they are secured by a number of means, better by means of frictional engagement with heat-sink ports. EFFECT: reduced cost of assembly suited to adjust load applied to electronic device. 15 cl, 8 dwg
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