FIELD: gluing composites. SUBSTANCE: invention relates to thermostable gluing composites based on synthetic high-molecular compounds used for metal gluing. Composite comprises the following components, mas. p. p.: polyamidobenzimidazole, 100; aluminum oxide, 2-10; tall colophony, 5-10; surface-active substance, 5; dimethylformamide, 150-200. The use of composite provides decrease of gluing temperature (145-150 C) and pressure (0.5-1.0 MPa) and retention of high exploitation indices of gluing composite. EFFECT: improved properties of composite. 2 tbl
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Authors
Dates
2002-11-27—Published
2000-07-25—Filed