FIELD: sealing materials. SUBSTANCE: invention relates to compounds for sealing electric ware including ferrite pieces of microwave devices, electric radio elements, etc. Compound contains 4,4'-isopropylidene epoxide resin, titanium-organosilicon oligomers, amine hardener, and organic solvent. Compound is prepared by mixing epoxide resin with organosilicon oligomers at ambient temperature followed by adding organic solvent or mixture of organic solvents, thorough stirring, adding epoxide resin hardener, additional stirring, evacuation at 25 +/- 10 C and pressure 1.6 to 1.3 kPa until bubbling ceased (but no longer than 30 min), hardening at 25 +/- 10 C for 1 h and then at 70 +/- 10 C for 3 h. EFFECT: increased moisture resistance and reduced viscosity and hardening temperature and time. 3 cl, 2 tbl, 3 ex
Title | Year | Author | Number |
---|---|---|---|
POLYMER COMPOSITION | 2002 |
|
RU2222558C1 |
COMPOUND AND METHOD OF PREPARING SAID COMPOUND | 2008 |
|
RU2378301C2 |
COMPOUND | 2005 |
|
RU2270214C1 |
POLYMERIC COMPOSITION | 2005 |
|
RU2285706C1 |
COLD SETTING COMPOUND | 2012 |
|
RU2481373C1 |
GLUING CURRENT-CONDUCTING COMPOSITION | 2006 |
|
RU2304159C1 |
COMPOSITION FOR COMPOUND | 1993 |
|
RU2064956C1 |
EPOXY-BASED POLYMER PROTECTIVE COMPOSITION FOR CONCRETE AND METAL SURFACES | 2023 |
|
RU2812779C1 |
METHOD OF OBTAINING FOAM COMPOUND | 2007 |
|
RU2326148C1 |
POLYMER COMPOSITION FOR HIGH-FREQUENCY ENERGY ABSORPTION | 2007 |
|
RU2343173C1 |
Authors
Dates
2002-12-10—Published
2000-12-20—Filed