COMPOSITION FOR COMPOUND Russian patent published in 1996 - IPC

Abstract RU 2064956 C1

FIELD: electrotechnical industry, sealing. SUBSTANCE: composition has, mas. p. : epoxy diane resin 90-110, and tin-siliconorganic oligomer of the formula Sn{[OSi(CH3(C6H5)]3CH3}4 40-60. Composition is used for electrotechnical article sealing. EFFECT: enhanced quality of composition. 2 tbl

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RU 2 064 956 C1

Authors

Chuvilina L.F.

Potsepnja O.A.

Zajchenko I.I.

Stepanova E.E.

Buzyreva N.M.

Vasetchenkova T.V.

Dates

1996-08-10Published

1993-07-01Filed