FIELD: electronic modules designed for building into electronic devices such as chip cards. SUBSTANCE: module has substrate, at least one surface with contact tracks, and integrated circuit secured on substrate and provided with output contacts each being connected to contact track of substrate. Module is characterized in that connections between output contacts and contact tracks are formed by seams of viscous current-conducting adhesive applied by dispensing method with aid of device such as syringe over contour between mentioned output contacts and contact tracks. In this way nodule of limited height is manufactured for card of greater thickness. EFFECT: enhanced mechanical strength of card. 6 cl, 3 dwg
