FIELD: electronics.
SUBSTANCE: installation of electronic components basically includes flat conducting platforms that are connecting to conducting paths, which are located on the surface of generally flat insulating foundation, which is called base. Specified method includes placement of base on working surface, so that surface with conducting paths is located on top; installation of electronic component in deepening in the base, which is located in the area that contains conducting paths, so that conducting platforms of electronic component enter in contact with corresponding paths on the base; application of insulating material layer, which simultaneously covers electronic component and at least area of base around specified component so that electric connection between conducting platforms and conducting paths is provided at the account of pressing force that is provided by insulating material layer on component.
EFFECT: provision of possibility of bending and twisting of transceiver without breakdown of connections between electronic components.
14 cl, 5 dwg
