METHODS FOR MANUFACTURING THREE-DIMENSIONAL ELECTRONIC MODULES, THREE-DIMENSIONAL ELECTRONIC MODULES Russian patent published in 2019 - IPC H01L25/04 

FIELD: electrical engineering.

SUBSTANCE: invention can be used for assembling electronic components in an electronic module. Essence of the invention consists in the fact that the manufacturing method of the three-dimensional electronic module includes the following stages: creating functional units, installing electronic components on process substrates with contact sites on side faces, testing the formed on the substrate functional unit, with a positive result of which is carried out further steps, method includes preparation of process filling equipment by its cleaning from foreign substances, impurities, drying and application of a separating lubricant, which has anti-adhesion properties, performing positioning of functional units in process filling, placing them in parallel one above another, combining contact pads, performing the heat-conducting electrically insulating compound and pouring the compound into the process filler, in the preparation and pouring of the heat-conducting electrically insulating compound, double degassing is used, performing polymerisation of a heat conducting electrically insulating compound, cutting side edges of the formed three-dimensional electronic module for opening contact pads of process substrates, cutting is carried out using equipment which enables to provide a minimum surface roughness of the three-dimensional electronic module side surfaces, method comprises cleaning the three-dimensional electronic module from possible contaminants, forming a continuous surface metallisation using a stencil printing method, by means of a laser beam, areas of surface metal coating on side faces are locally removed, thus forming separate metallization paths switching required contact pads according to electric diagram of a three-dimensional electronic module.

EFFECT: possibility of improving the reliability of the manufactured three-dimensional electronic modules.

30 cl, 7 dwg