FIELD: production of cards or electronic labels bearing electronic components.
SUBSTANCE: proposed method for producing cards or electronic labels by assembling them of at least one thin flexible substrate 7, conducting layer 4, and binding layer 1 and incorporating at least one electronic component 11 includes following operations: at least one segment 6 is formed in conducting layer 4; at least one window 2 is formed in binding layer 1; at least one window 8 is formed in substrate 7, mentioned window 8 being designed to accommodate electronic component 11; binding layer 1 and conducting layer 4 are applied to substrate and laminated to afford alignment between holes 2, 8 made in advance; electric circuit is set up from plurality of tracks, and at least one electric contact 4' is formed for electronic component 4 disposed in window of substrate 7; electronic component 11 is disposed in window 8 formed for the purpose in substrate 7 and connected therein.
EFFECT: enhanced quality of contact between electronic component or components and tracks on conducting surface of card.
11 cl, 8 dwg
