FIELD: polymer materials. SUBSTANCE: invention provides composition containing at least one copper salt in concentration corresponding to 10-1000 ppm copper and at least one halogen-containing organic compound in concentration corresponding to 50-30000 ppm halogen, copper-to-halogen ratio in stabilized polyamide composition ranging from 1:1 to 1:3000. halogen-containing compound is, in particular, selected from group including halogen-containing aromatics, halogen-containing aliphatic phosphates, halogenated paraffins, and their mixtures, provided that, when aromatic compound is brominated styrene oligomer, polyamide is no polyamide-4,6 and that halogen-containing aromatic compound is no iodine-containing compound. EFFECT: avoided brittle behavior of material owing to released organics and elevated long-time running maximal temperature. 11 cl, 7 tbl, 6 ex
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Authors
Dates
2003-06-27—Published
1999-10-15—Filed