PRINTED-CIRCUIT BOARD Russian patent published in 2004 - IPC

FIELD: microelectronics; printed-circuit boards. SUBSTANCE: printed-circuit board has insulating wafer with slots and holes, as well as current conducting components. Slots are made on both ends of wafer in longitudinal and transverse directions, spaced apart more than one width of slot on wafer surface but not more than double width of slot on wafer surface; these slots are intercommunicating through holes; slots are isosceles trapezium shaped in cross-section, their sides being inclined through 2 to 45 deg. relative to vertical axis; larger base of trapezium is disposed in same plane as wafer surface; holes are formed by two truncated cones having common smaller base, generating line of cone being inclined through 2 to 45 deg. relative to vertical axis; cone diameter with its conical surface extrapolated to point of intersection with wafer surface does not exceed slot width on wafer surface; current-conducting components are formed by filling slots and holes with conducting material. EFFECT: improved design, enhanced packing density of conductors. 1 cl, 3 dwg