ENCAPSULATED CASE FOR RADIO-ELECTRONIC BOARDS Russian patent published in 2004 - IPC

Abstract RU 2233567 C1

FIELD: electrical engineering; printed-circuit boards, packages or parts and encapsulated cases for electrical equipment.

SUBSTANCE: encapsulated case designed to maintain serviceable condition of printed-circuit board after its encapsulation has base and cover made of thermoplastic polymeric material and incorporates locking members in the form of V-shaped projection with groove and retaining members. Polybutylene terephthalate can be used as thermoplastic polymeric material.

EFFECT: enhanced strength, reliability, and productivity; reduced labor consumption.

2 cl, 6 dwg

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RU 2 233 567 C1

Authors

Berezina I.E.

Kondratenkov S.V.

Legkij N.M.

Kumanaev V.V.

Dates

2004-07-27—Published

2002-10-28—Filed