METHOD FOR PRODUCTION OF SEALED ELECTRONIC MODULE Russian patent published in 2019 - IPC C09K3/10 C08L83/04 H01L23/10 

FIELD: radio engineering; electronics.

SUBSTANCE: invention relates to radio electronics. Printed-circuit board with suspended elements is installed on the metal base with blind threaded holes. Metal base is placed with the printed-circuit board under the internal cover, which repeats along the perimeter the shape of the printed-circuit board with formation of compartments for the functional sections of the electric circuit with provision of their mutual radio tightness, and installed on the side of the suspended elements. Outer cover is installed over the inner cover, the space between the metal base and the outer cover is filled with an elastic seal. Elastic seal is made in the form of a closed ring of rubber mixture based on silicone rubber. Soldering of the housing of the coaxial connector to the metal base and connection of the central contact to the strip conductor of the printed-circuit board in one of the compartments is performed with a soldered joint.

EFFECT: disclosed method enables to reduce labour intensity and duration of technological process while maintaining repairability of electronic modules.

1 cl, 1 dwg