FIELD: radio-electronic engineering; electronic device cases including sealed ones.
SUBSTANCE: case base and cover are made of thermoplastic polymeric material. Base-to-cover joint is made in the form of V-shaped projection and groove. Encapsulated joint is obtained by ultrasonic welding over its entire perimeter in pulsed mode at static pressure; ultrasonic waves are converted into mechanical vibrations and joint is exposed to same pressure during its cooling-down period of not shorter than ultrasonic pulse duration. Electric board maintains its serviceability upon such encapsulation of its case.
EFFECT: enhanced strength, reliability , and productivity; reduced labor consumption.
3 cl, 6 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| ENCAPSULATED CASE FOR RADIO-ELECTRONIC BOARDS | 2002 |
|
RU2233567C1 |
| METHOD FOR PRODUCTION OF SEALED ELECTRONIC MODULE | 2018 |
|
RU2697458C1 |
| HERMETIC HOUSING FOR HIGH-VACUUM PRECISE INSTRUMENT AND METHOD FOR ITS MANUFACTURING | 2008 |
|
RU2356126C1 |
| VACUUM MICROGYROSCOPE MANUFACTURING METHOD | 2012 |
|
RU2521678C1 |
| DISSIMILAR MATERIALS BONDING WITH ELECTRONIC BEAM TECHNIQUE | 2016 |
|
RU2635123C1 |
| ELECTRONIC DEVICE | 2004 |
|
RU2275762C1 |
| 0 |
|
SU1780200A1 | |
| ELECTRICAL TERMINAL BOX (VARIANTS) | 2012 |
|
RU2623444C2 |
| SEALED DEVICE CASE | 2010 |
|
RU2455802C2 |
| SEMICONDUCTOR DEVICE ASSEMBLING METHOD | 1999 |
|
RU2171520C2 |
