FIELD: electrodeposition, in particular copper plating of steel.
SUBSTANCE: invention relates to electrolyte for copper plating useful in machine-building and instrument engineering. Claimed electrolyte contains copper sulfate 100-120 g, ammonium sulfate 220-250 g, polyethylene-polyamine 20-40 g, 25 % aqueous ammonia solution 80-100 ml, bromothymol blue 1-3 mmol/l, and water up to 1 l. Electrolyte makes it possible to obtain high quality well adhered electroplated coatings without using of intermediate layer, essentially without of steel base hydrogen charging.
EFFECT: electroplated coatings of high quality.
3 tbl, 3 ex
Title | Year | Author | Number |
---|---|---|---|
BRIGHT COPPER PLATING ELECTROLYTE | 1999 |
|
RU2179203C2 |
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RU2215829C1 |
AQUEOUS BRIGHT COPPER PLATING ELECTROLYTE | 2002 |
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RU2239008C2 |
ELECTROLYTE FOR PRECIPITATION OF NICKEL-IRON ALLOY COATS ON STEEL SUBSTRATES | 2003 |
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RU2314366C2 |
Authors
Dates
2004-10-10—Published
2002-07-25—Filed