FIELD: electroplating. SUBSTANCE: invention relates to copper plating on steel having no intermediate underlayer and may be applied in mechanical and instrumentation engineering to produce plastic copper coatings with minimal hydrogenation of steel substrate. Corresponding electrolyte contains 100-120 g of cupric sulfate, 200-250 g of ammonium sulfate, 70-110 ml of 25% ammonia aqueous solution, 1-3 mmol of Congo red, 2-6 g of polyethylenepolyamine, 1-3 mmol of 2,4-dinitrophenylhydrazine, and water to 1 l. pH of solution is 9-10. EFFECT: eliminated pores in copper coatings with mirror surface and minimized steel hydrogenation. 3 tbl
Title | Year | Author | Number |
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BRIGHT COPPER PLATING ELECTROLYTE | 1999 |
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Authors
Dates
1998-01-27—Published
1995-06-06—Filed