FIELD: electrodeposition, in particular copper plating of steel.
SUBSTANCE: invention relates to electrolyte for copper plating useful in machine building and instrument engineering. Claimed electrolyte contains copper sulfate 75-85 g, ammonium sulfate 75-85 g, sodium sulfate 30-40 g, nickel sulfate 10-20 g, 25% aqueous ammonia solution 170-180 ml, N-methylpiperazide-2,3-pentamethylenequinoline-4-carboxylic acid 10-4-5x10-3 mol/l, and water up to 1 l. Invention makes its possible to obtain high quality electroplated coatings with fine-crystalline structure, mirror (brightness of 100 relative units), well adherent with base without using of intermediate layer, essentially nonporous, and without of steel base hydrogen charging (98,0-92,7 %).
EFFECT: electroplated coatings of high quality.
3 tbl, 3 ex
| Title | Year | Author | Number |
|---|---|---|---|
| ELECTROLYTE FOR COPPER PLATING OF STEEL PARTS | 2002 |
|
RU2237755C2 |
| BRIGHT COPPER PLATING ELECTROLYTE | 2002 |
|
RU2215829C1 |
| AQUEOUS BRIGHT COPPER PLATING ELECTROLYTE FOR | 1999 |
|
RU2175999C2 |
| ELECTROLYTE FOR THE BRIGHT COPPER COATING | 2004 |
|
RU2278908C1 |
| ELECTROLYTE FOR BRIGHTENED COPPER PLATING | 2001 |
|
RU2194097C1 |
| AQUEOUS ELECTROLYTE FOR BRIGHT COPPER COATING OF STEEL BACKPLATES | 2004 |
|
RU2361969C2 |
| BRIGHT COPPER PLATING ELECTROLYTE | 1999 |
|
RU2179203C2 |
| AQUEOUS ELECTROLYTE FOR BRIGHT COPPER PLATING | 2003 |
|
RU2323275C2 |
| ELECTROLYTE FOR BRIGHTENED COPPER PLATING | 2001 |
|
RU2194098C1 |
| AQUEOUS BRIGHT COPPER PLATING ELECTROLYTE | 2002 |
|
RU2239008C2 |
