FIELD: physics.
SUBSTANCE: invention relates to copper coating on steel backplate without application of intermediate layer; this invention can be used in mechanic engineering, radio engineering and instrument-making industry. Electrolyte contains 30-50 g of copper sulphate, 120-180 g of sodium pyrophosphate, 70-100 g of disubstituted sodium phosphate, 1-5 mmol/l of N-allyldiethylenetriamine chloride, 1-5 mmol/l of pyridine sulphur triethylammonium chloride and water up to 1 litre.
EFFECT: quality improvement of porous-free copper coatings with mirrored surface.
3 tbl, 3 ex
| Title | Year | Author | Number |
|---|---|---|---|
| ELECTROLYTE FOR BRIGHTENED COPPER PLATING | 2001 |
|
RU2194097C1 |
| ELECTROLYTE OF BRIGHT NICKEL PLATING | 1999 |
|
RU2175690C2 |
| ELECTROLYTE FOR BRIGHT NICKEL PLATING | 2000 |
|
RU2194803C2 |
| ELECTROLYTE FOR BRIGHT NICKEL-PLATING | 2001 |
|
RU2210638C2 |
| ELECTROLYTE FOR BRIGHTENED COPPER PLATING | 2001 |
|
RU2194098C1 |
| AQUEOUS ELECTROLYTE FOR BRIGHT COPPER PLATING | 2003 |
|
RU2323275C2 |
| SHINE COPPER-PLATING ELECTROLYTE | 0 |
|
SU812857A1 |
| BRIGHT COPPER PLATING ELECTROLYTE | 2002 |
|
RU2215829C1 |
| AQUEOUS BRIGHT COPPER PLATING ELECTROLYTE FOR | 1999 |
|
RU2175999C2 |
| ELECTROLYTE FOR COPPER COATING STEEL PADS | 2008 |
|
RU2385366C1 |
