FIELD: powder metallurgy.
SUBSTANCE: parts of devices protecting against radioactive emission or electric contacts are proposed to be manufactured from tungsten/copper pseudoalloy. Tungsten powder is mixed with binder containing 0.5-1.5% colophony and 0.05-0.15% ammonium formate or citrate. Resulting mixture is compacted and resulting porous blanc is brought into contact with copper. The total is thermally treated by gradually raising temperature: first in vacuum to remove binder and to melt copper and then in argon atmosphere to 1360-1410оС.
EFFECT: increased wettability and uniformity of impregnation, and eliminated explosive risk due to excluded use of hydrogen.
3 cl, 1 tbl, 10 ex
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Authors
Dates
2005-01-10—Published
2003-06-24—Filed