FIELD: optical engineering.
SUBSTANCE: at least two dielectric layers are produced with preset thickness. Layers are disposed one onto the other to form pack of layers. Thickness of layer packs is subject to reduction and thicknesses of separate layers are similarly reduced by means of deforming layer packs to keep relation of thicknesses or relation of thicknesses of layers. Layer pack is disposed between two carrying layers before subjecting the layers to deformation. At least one carrying layer is formed from several separate layers, which are supposed to be disposed subsequently at the end of process of partial deformation at any previous layer of carrying layer. Separate layers of carrying layer can be overlayed onto previous separate layers of carrying layer.
EFFECT: simplified process of manufacture; improved reflection factor.
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