WIRE-WOUND HEAT SINK Russian patent published in 2005 - IPC

FIELD: radio engineering and radio electronics; cooling semiconductor devices of electronic equipment both by natural and forced convection.

SUBSTANCE: proposed wire-wound heat sink characterized in rigid mechanical design which makes it possible to keep wire loops stable both in the course of manufacture and in service is made of wire of submillimetric diameter ranging between 0.005 and 0.5 mm. This heat sink has base mounting wire sections secured thereon at both ends to form loops joined together by means of additional supporting frame; the latter is fixed in position relative to base. Heat-conducting material can be used for base, and ends of wire sections are secured on base to ensure thermal contact. Loops may be secured on supporting frame to ensure thermal contact. Supporting frame may be fixed in position relative to base by means of at least one cross-member secured on base. Cross-member and supporting frame may be made of heat-conducting material.

EFFECT: augmented heat transfer, enhanced cooling efficiency of heat sink.

4 cl, 8 dwg