FIELD: semiconductor devices or solid-state cryorefrigerators.
SUBSTANCE: proposed heat sink that can be used as cooling or heating , or ventilating facility and mainly for Peltier-effect cooling or heating devices has developed heat-transfer surface component and cooling agent inlet and outlet pipes. This developed heat transfer component is essentially screen nozzle of woven metal net placed in sealed capsular container provided with pipe connections. Screen nozzle can be made of screens having different size of mesh and different wire diameters. In addition, screen nozzle can be made of separate net blocks and the latter can be separated by distance pieces. Heat sink has enlarged heat-transfer surface and enhanced packing coefficient, that is ratio of heat-transfer surface area to volume occupied by this surface and is capable of transferring high-density heat fluxes.
EFFECT: enhanced heating efficiency, reduced hydraulic and/or aerodynamic drag.
4 cl, 4 dwg
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Authors
Dates
2006-04-20—Published
2004-10-01—Filed