COOLING DEVICE FOR ELECTRONIC COMPONENTS Russian patent published in 2013 - IPC G12B15/00 G06F1/20 H05K7/20 

FIELD: information technology.

SUBSTANCE: invention can be used normalising temperature of electronic components, particularly central processing units (CPU) of modern computers, which are meant for installation in street conditions or in rooms with unfavourable ambient conditions: high dust content, high humidity, as well as at high temperatures. The cooling device for electronic components has a housing on the outer surface of one of the vertical walls, which are the heatsink, of which there are heat-scattering fins, and inside the housing there is a base heat-transfer unit meant for contact with the heat-loaded electronic components; the base heat-transfer unit is connected to heat pipes with a capillary-porous structure, which are connected to the heatsink; part of the heat pipes lies above the base heat-transfer unit (ascending heat pipes) and the other part lies below the base heat-transfer unit (descending heat pipes); the pore radius of the inner structure of the ascending and descending heat pipes is different and is selected based on a condition of compensation for the effect of gravitational force on heat transfer characteristics; the pore radius of the inner structure of the ascending and descending heat pipes is selected from the following condition: where ρ is the density of the heat carrier; g is gravitational acceleration; R_H is the pore radius in the capillary structure of descending heat pipes; R_B is the pore radius in the capillary structure of ascending heat pipes; h_B is the height of the heat-removing part of the ascending heat pipes over the base; h_H is the height of the heat-removing part of the descending heat pipes below the base.

EFFECT: high uniformity of the temperature field on the height of the heatsink and low temperature in region of connection of the outlet part of the heat pipes while simplifying the design of the cooling device, which improves functional capabilities of the device and increases its reliability.

10 cl, 4 dwg