FIELD: electrical engineering.
SUBSTANCE: proposed cooling apparatus has heat sinks disposed on components of electronic devices being cooled down, remote radiative cooler, and heat pipe. Radiative cooler is placed above heat sinks. Heat pipe has four types of sections, that is, heated zones, intermediate zones carrying working medium in the form of steam, cooled zone , and intermediate zones carrying working medium in the form of liquid. Intermediate zones of heat pipe are made in the form of flexible hoses. Working medium of heat pipe is liquid whose boiling temperature at atmospheric pressure is higher than working temperature of electronic components being cooled down.
EFFECT: provision for cooling devices having frequently varying configuration and for dispensing with fire-hazard and environmentally detrimental materials as working media.
5 cl, 2 dwg
