FIELD: electrical engineering; cooling microprocessor unit heat-dissipating components.
SUBSTANCE: proposed heat sink designed to transfer heat dissipated by electronic component formed on semiconductor chip surface to heat-dissipating working medium directly or through thin film of their separating inert material wetted by liquid working medium is made in the assembled of group of sealed cells disposed on microprocessor chip surface on side of heat-dissipating components; opposite side of cells is disposed on surface of wafer made of high-conductivity metal; inner surfaces of cells are made of material easily wettable with working medium or covered with thin layer of such material; top part of walls is made of material poorly wettable with working medium; inner space of cells is partially filled with liquid working medium and remaining space, with working-medium vapors.
EFFECT: enhanced cooling efficiency of heat sink.
7 cl, 3 dwg
