FIELD: technological processes of metal treating, namely production of printed circuit boards, plating.
SUBSTANCE: solution contains, g/l: nitric acid, 252 - 315; iron nitrate, 50 - 100; sodium chloride, 1 - 5; tin ions - up to 150. Invention provides increased rate of etching tin coating up to 15 micrometer/min.
EFFECT: increased rate of etching tin coating, enhanced stability and strength of procedures realized with use of solution.
1 ex
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