FIELD: chemistry.
SUBSTANCE: selective etching agent for removal of tin-lead coatings from copper base contains H[BF4] (40% solution) 910-930 ml/l, H2O2 (35% solution) 70-90 ml/l, Cu(NO3)2 0.03-0.04 g/l, KF 5-8 g/l, NaNO3 5.5-7.5 g/l, oleox-5 0.6-0.7 g/l.
EFFECT: invention makes it possible to increase selectivity of etching of galvanic tin-lead coatings with copper base due to reduction of copper etching rate.
1 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| PREFERENTIAL ETCH OF GALVANIC TIN-AND-LEADEN OF COATINGS FROM COPPER BASIS | 2008 |
|
RU2351689C1 |
| SELECTIVE ETCHANT FOR REMOVAL OF TIN-AND-LEADEN COATINGS FROM COPPER BASE | 2011 |
|
RU2470093C1 |
| SELECTIVE ETCHER OF MULTI-COMPOSITE ELECTROLYTIC COATINGS BASED ON TIN AND LEAD | 2018 |
|
RU2690871C1 |
| 0 |
|
SU553273A1 | |
| SOLUTION FOR STRIPPING TIN-LEAD COATINGS FROM COPPER BASE | 2003 |
|
RU2257424C2 |
| AQUEOUS SOLUTION FOR CHEMICAL DEPOSITION OF TIN ON COPPER OR COPPER ALLOY SURFACE | 2014 |
|
RU2564190C1 |
| METHOD OF PRODUCTION OF DOUBLE-SIDED PRINTED BOARD | 2013 |
|
RU2543518C1 |
| METHOD FOR PREPARING DICOPPER (II) ETHYLENEDIAMINETETRAACETATE | 2002 |
|
RU2235719C2 |
| SOLUTION FOR CLARIFICATION OF COAT OF TIN-LEAD ALLOY ON PRINTED CIRCUIT BOARDS | 1992 |
|
RU2019926C1 |
| PROCESS OF PREPARATION OF COMBINED COPPER-POLYIMIDE SURFACE TO FORMATION OF COATING BY CHEMICAL CONVERSION | 1992 |
|
RU2041575C1 |
