FIELD: metallurgy.
SUBSTANCE: invention relates to chemical treatment of metals and is intended in production of printed boards with protective soldering mask on copper. Selective etchant comprises nitric acid, iron nitrate, sodium chloride, benzene azimide as copper etching inhibitor and ethyl alcohol at the following ratio of components: 200-250 ml/l of 68%-solution of HNO3, 130-170 g/l of Fe(NO3)3·9H2O, 2-3 g/l of NaCl, 0.5-1 g/l of benzene azimide, 5-6 ml/l of ethyl alcohol.
EFFECT: higher selectivity of etching.
1 tbl
| Title | Year | Author | Number |
|---|---|---|---|
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| 0 |
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