METHOD FOR NONDESTRUCTIVE CHECK FOR MOISTURE CONTENT IN UNDER- PACKAGE SPACE OF INTEGRATED CIRCUITS Russian patent published in 2005 - IPC

FIELD: microelectronics; radio equipment manufacture.

SUBSTANCE: proposed method that can be used for inspecting and sorting out integrating circuits during their mass production as well as during inspection tests includes cooling of integrated circuit down to -65 °C at the same time continuously monitoring moisture-sensing electrical parameter, that is parameter responding to surface condition of circuit chip, for instance current leakage, followed by its heating at the same rate to room temperature while also measuring electrical parameter. Onset of measured parameter growth corresponds to dew point for under-package gas. Gas pressure in integrated circuit is calculated at dew point and moisture concentration in under-package space is found from nomogram.

EFFECT: simplified design of equipment used for nondestructive moisture control without bringing in uncontrolled defects.

1 ck, 2 dwg, 1 tbl