FIELD: heat conductors.
SUBSTANCE: invention relates to diamond-containing composites, which show high heat-conductivity and high temperature-conductivity for use in heat absorbers, heat distributors, and in other cases where heat-conducting materials are required. Material contains 55-81% diamond particles, 3-39% silicon carbide, and up to 41% silicon showing heat-conductivity at least 400 W/(m·K) and temperature-conductivity at least 2.1 cm2/sec. Diamond particles are made up of at least two fractions with different particle size, at least 50% of particles having diameter 80 μm and larger.
EFFECT: increased heat conductivity of material.
7 cl, 2 dwg, 3 tbl
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