HEAT SINK ELEMENT AND METHOD OF ITS MANUFACTURE Russian patent published in 2023 - IPC H01L23/373 B82B3/00 

FIELD: electronic technology.

SUBSTANCE: invention is related in particular to a device for heat removal in form of a heat sink element and to a method for manufacturing such device, and is intended primarily for use as an electrically insulating substrate heat sink in manufacturing of semiconductor devices and electronic systems. The heat sink element contains a ceramic-based plate made of aluminum nitride with a layer based on silicon carbide. The silicon carbide layer consists of a layer of vertically oriented carbon nanotubes impregnated with silicon deposited on the surface of aluminum nitride ceramics, with layers of metals deposited on the surface. The method for manufacturing a heat-sinking element involves depositing a layer of vertically oriented carbon nanotubes on the surface of a ceramic-based aluminum nitride plate, impregnating it with silicon to form silicon carbide, grinding, polishing, and depositing layers of metals on these surfaces.

EFFECT: reducing thermal resistance, mass and volume of the heat-removing element, increasing conductive thermal conductivity and efficiency of heat removal from the heat-generating active element to the heat sink.

2 cl, 8 dwg