FIELD: chemical industry. SUBSTANCE: composite material comprises the following components, vol. %: diamond grains, 50-85; silicon, 2-49; silicon carbide, 1-48. Matrix of material consists of silicon carbide and silicon. The content of diamond grains of size above 40 mcm is 25%, not less, of total diamond amount in material. Heat conductivity coefficient of the composite material at the room temperature is above 300 W/m•K and thermal conductivity coefficient is less 1.6 •10-4m2/s. Material exhibits also high hardness and wear resistance and can be used for preparing articles with the required forms with volume 10 mm3 being without additional mechanical treatment. Invention can be used in preparing heat- removal pipes and heat exchangers. EFFECT: valuable properties and indices of material. 4 ex
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Authors
Dates
2003-06-20—Published
2000-11-21—Filed