GLUING COMPOSITION Russian patent published in 2006 - IPC C09J163/02 C09D163/02 C09K3/10 

FIELD: glues compositions and materials.

SUBSTANCE: invention proposes gluing composition comprising the following ratio of components, mas. p. p.: epoxy diane resin, 30-40; monofunctional oligoester epoxide, 8-10; trifunctional oligoester epoxide, 8-10; tricyclocarbonate polyoxypropylenetriol, 12-15; low-molecular polyamide resin, 18-20, hardening agent of amine type, 7-10, and filing agent, 10-15. Invention provides enhancing relative stretching elongation value of the composition in retention of its high strength and adhesion indices. Invention can be used in gluing heterogeneous materials with different expanding temperature coefficients in units subjecting to high vibration and impact loads and effect of temperature from -150°C to 200°C.

EFFECT: improved and valuable properties of composition.

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