COMPOSITION FOR HEAT-CONDUCTING GLUE FORMULATION Russian patent published in 2006 - IPC C08L63/02 

FIELD: adhesives.

SUBSTANCE: invention relates to epoxide compositions for preparing heat-conducting glue formulations intended to join metals: steels, aluminum and titanium alloys, and ceramics to extract heat from heated members of instruments and to cool heavy-duty units and parts. Composition may be employed as sealing protective heat-extracting coating or layer in electrical and other appliances or to join and to seal parts of glass, ferrite, ceramics, aluminum, steel, and other materials. Composition contains epoxide 4,4'-isopropylidenediphenol resin, aliphatic amines as hardener, boron nitrile as heat-conducting filler, polyoxypropylenetriol triglycedyl ether (Laproksid 603), butylcellosolve monoglycedyl ether (Laproksid 301), and low-molecular weight polyamide resin.

EFFECT: enabled preparation of heat-conducting cold-cure glue formulation with high heat conductivity combined with sufficient adhesion shear strength and cohesion stretching strength.

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