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2 388 779

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IPC

C09J163/00(2006-01-01)

C08L63/02(2006-01-01)

(21) (22)

Application

2009106107/04, 2009-02-20

(24)

Start date

2009-02-20

(22)

Actual filing date

2009-02-20

(45)

Published

2010-05-10

(72)

Inventor

Bryzgalina Galina VladimirovnaSimunova Svetlana SergeevnaMadanova Ekaterina Jur'EvnaTregubov Vladislav AlekseevichKonovalikova Vera Nikolaevna

(73)

Holder

Otkrytoe Aktsionernoe Obshchestvo Institut Priborostroenija Imeni V.V. Tikhomirova"

HEAT-CONDUCTING ADHESIVE COMPOSITION Russian patent published in 2010 - IPC C09J163/00 C08L63/02

Abstract RU 2388779 C1

FIELD: chemistry.

SUBSTANCE: invention relates to a heat-conducting adhesive composition designed for attaching components in order to dissipate heat from warm components for radio engineering purposes and for cooling heat-loaded components working under impact and vibration loads. The composition contains an epoxide diane resin, butyl cellosolve monoglycidyl ether Laproxide 301, polyoxypropylene triol triglycidyl ether, boron nitride and a low-molecular polyamide resin. The composition additionally contains an ethylenediaminomethylphenol AF-2 hardener. The polyoxypropylene triol triglycidyl ether used is Laproxide 703.

EFFECT: use of the composition increases adhesive shear strength combined with high heat-conductivity.

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RU 2 388 779 C1

Authors

Bryzgalina Galina Vladimirovna

Simunova Svetlana Sergeevna

Madanova Ekaterina Jur'Evna

Tregubov Vladislav Alekseevich

Konovalikova Vera Nikolaevna

Dates

2010-05-10—Published

2009-02-20—Filed