NICKEL BASE SOLDER Russian patent published in 2006 - IPC B23K35/30 C22C19/05 

FIELD: manufacture of soldered parts of radiators, heat exchangers, honeycomb boards and other structures including thin-wall members of stainless steels.

SUBSTANCE: solder contains next relation of ingredients, mass %: chrome, 3.0 - 17.9; iron, 0.1 - 10.0; molybdenum, 0.5 - 6.0; silicon, 3.0 -6.5; cobalt, 0.1 - 10.0; niobium, 0.1 - 2.9; titanium, 0.1 - 2.9; boron, 1.2 - 1.6; manganese, 0.1 - 2.0; nickel, the balance. Solder in the form of amorphous metallic strip features improved technological plasticity, low erosion activity in relation to basic material, soldering temperature lower than 1100°C.

EFFECT: possibility for lowering mass of soldered structure, for improving technological effectiveness of soldering process due to high accuracy of solder dozing.

2 tbl, 1 ex