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2 273 556

(13)

(51)

IPC

B23K35/30(2006-01-01)

C22C9/05(2006-01-01)

C22C9/06(2006-01-01)

(21) (22)

Application

2004128999/02, 2004-10-05

(24)

Start date

2004-10-05

(22)

Actual filing date

2004-10-05

(45)

Published

2006-04-10

(72)

Inventor

Kablov Evgenij NikolaevichLukin Vladimir IvanovichRyl'Nikov Vitalij SergeevichSidorov Aleksej IvanovichCherkasov Aleksej FilippovichTitov Vjacheslav Ivanovich

(73)

Holder

Federal'Noe Gosudarstvennoe Unitarnoe Predprijatie Nauchno-Issledovatel'Skij Institut Aviatsionnykh Materialov"

COPPER BASE SOLDER Russian patent published in 2006 - IPC B23K35/30 C22C9/05 C22C9/06

Abstract RU 2273556 C1

FIELD: metallurgy, namely copper base solders that may be used for making parts and units of different designation.

SUBSTANCE: copper base solder contains nickel, manganese, cobalt, silicon, iron, boron, phosphorus and titanium.

EFFECT: enhanced plastic properties of high-strength stainless steels tinned by such solder, improved corrosion proofness and strength of soldered joints.

2 tbl, 3 ex

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RU 2 273 556 C1

Authors

Kablov Evgenij Nikolaevich

Lukin Vladimir Ivanovich

Ryl'Nikov Vitalij Sergeevich

Sidorov Aleksej Ivanovich

Cherkasov Aleksej Filippovich

Titov Vjacheslav Ivanovich

Dates

2006-04-10—Published

2004-10-05—Filed