SOLDER AND SOLDERING METHOD Russian patent published in 1995 - IPC

FIELD: soldering. SUBSTANCE: solder contains (atomic): iron 0.01-4; chromium 5-21, silicon 1-19; boron 1-16; cobalt 1-20; at least one component selected in the group containing molybdenum; tungsten; vanadium, niobium; tantalum; manganese; copper 0.01-8; nickel the balance. Solder may have amorphous structure for at least 50% Solder is made in the form of rapid-hardened tape. Solder powder made from tempered rapid- hardened tape may be used. Method involves usage of solder having above mentioned composition and compensate gasket containing (atomic): nickel 20-55; cobalt 0.01-30; iron the balance. Compensate gasket allows different linear thermal expansion coefficients of caked solid alloy and tool steel to be compensated. EFFECT: increased efficiency and high quality of solder. 3 cl, 1 tbl