FIELD: application of coatings of palladium and its alloys with noble metals such as silver, gold, platinum, rhodium, ruthenium and with some non-noble metals such as copper, antimony, bismuth, tin, lead, nickel, possibly in microelectronics, electrical engineering, electrochemical systems.
SUBSTANCE: method comprises steps of degreasing, chemical etching and(or) activating, washing out and treating articles with plating solution of cyan free salts of applied metals such as nitrates, halides in organic solver selected from alkyl phosphates, sulfur-containing solvent, acidic acid and (or) propylene carbonate at temperature 20 - 150°C. Ammonium chloride, bromide or rhodanide and also monohydric or multihydric alcohol is added to plating solution.
EFFECT: possibility for applying thin-layer high adhesion strength coatings of palladium and its alloys upon metallic parts at controlling thickness of coating, its physical and chemical properties, increased wear resistance of parts in different conditions.
2 ex, 2 tbl
