NON-CONTACT OR HYBRID CONTACT/NON-CONTACT CARD WITH MICRO-CHIP AND INCREASED RESISTANCE OF ELECTRONIC MODULE Russian patent published in 2007 - IPC G06K19/77

Abstract RU 2295155 C2

FIELD: engineering of non-contact or hybrid contact/non-contact cards with microchips.

SUBSTANCE: card with microchip contains antenna positioned on substrate of fibrous material like paper, two body plates of card on each side of substrate, consisting of at least one layer of plastic, having low melting temperature, and electronic module, containing microchip connected to antenna, while card is formed by substrate of antenna and two body plates, connected by lamination welding by heating under pressure, substrate of fibrous material contains at least one groove so that plastic layers of body plates of card merge during lamination, and this groove forms welding seam between body plates of card.

EFFECT: increased resistance of electronic module.

9 cl, 6 dwg

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RU 2 295 155 C2

Authors

Alop Kristof

Dates

2007-03-10—Published

2002-09-13—Filed