METHOD OF MOUNTING ELECTRONIC COMPONENT ON SUBSTRATE AND DEVICE FOR MOUNTING SAID COMPONENT Russian patent published in 2010 - IPC G06K19/77 

Abstract RU 2398280 C2

FIELD: information technology.

SUBSTANCE: method of mounting onto a base at least one electronic component having a microcircuit which has at least one electrical contact on one of the surfaces and at least one segment of a conducting track connected to the said at least one electric contact includes the following steps: formation of the said at least one conducting track segment having a predefined outline; clamping the said at least one track segment and the microcircuit with an adjustment device, where each track segment has a part facing the contact of the microcircuit or lies on the said contact; moving the said electronic component held by the adjustment device into a predefined position relative the base; embedding the said electronic component into the base.

EFFECT: maximum accuracy during manufacture of an electronic component based on microcircuits, and the process of mounting such a component onto an insulating substrate.

41 cl, 17 dwg

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RU 2 398 280 C2

Authors

Droz Fransua

Dates

2010-08-27Published

2006-02-01Filed